1 / 3 www.asb.co.kr february 201 2 p lerow tm aln0 332 internally matc hed lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - moun t module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 329 335 gain db 30 31 gain flatness db ? 0. 1 ? 0. 2 noise figure db 0.8 0.9 output ip3 dbm 36 37 s11/s22 db - 1 5 / - 1 5 output p1db dbm 20 21 switching ti me (3) ? sec - supply current ma 1 8 0 200 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23~25 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of + 4 dbm/tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fro m 0 v to v s . pin number function 3 rf in 8 rf out 10 v s other s ground ou t line drawing (unit: mm) feature s s 21 = 31.1 db@ 329 mhz = 30.9 db@ 335 mhz n f of 0.8 db over fr e quency unconditionally stable single 5 v supply high oip3@low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description aln0 332 asb inc. (top view) (bottom view) solder ste ncil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 asb inc., 4th fl. venture town bldg., 367 - 17 goijeong - dong, seo - gu, daejon 302 - 716, korea more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ.@t = 25 ? c, v s = 5 v, freq. = 332 mhz, z o.sys = 50 ohms
2 / 3 www.asb.co.kr february 201 2 p lerow tm aln0 332 internally matc hed lna module s - param e ters noise figure oip3 p1db 329 ~ 335 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 3 www.asb.co.kr february 201 2 p lerow tm aln0 332 internally matc hed lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performa nce . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 ca pacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process + - aln out in c1 c2 v s tantal or mlc (multi l ayer c e ramic) c a pacitor 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) in out vs size 25x25mm (for aln series C 13x13mm) evaluation board layout
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